{"id":3960,"date":"2021-01-05T10:46:59","date_gmt":"2021-01-05T10:46:59","guid":{"rendered":"http:\/\/engineering.tiu.edu.iq\/mechatronics\/?p=3960"},"modified":"2021-05-26T15:49:41","modified_gmt":"2021-05-26T15:49:41","slug":"scientific-trip-to-field-ready","status":"publish","type":"post","link":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/","title":{"rendered":"Scientific Trip to Field"},"content":{"rendered":"
The Mechatronics Department organized a trip to help students gain a better understanding in advance manufacturing technologies and product development. The scientific trip allowed the participants to analyze the use of 3D printers and design prototype models in several engineering fields. The information gathered will assist students with their existing projects related to mechatronics, robotics, automation…etc.<\/div>\n
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The Mechatronics Department organized a trip to help students gain a better understanding in advance manufacturing technologies and product development. The scientific trip allowed the participants to analyze the use of 3D printers and design prototype models in several engineering fields. The information gathered will assist students with their existing projects related to mechatronics, robotics, automation…etc.<\/p>\n","protected":false},"author":67,"featured_media":4204,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wds_primary_category":0,"footnotes":""},"categories":[2,1],"tags":[],"class_list":["post-3960","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-uncategorized"],"yoast_head":"\nScientific Trip to Field - Mechatronics Department<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Scientific Trip to Field - Mechatronics Department\" \/>\n<meta property=\"og:description\" content=\"The Mechatronics Department organized a trip to help students gain a better understanding in advance manufacturing technologies and product development. The scientific trip allowed the participants to analyze the use of 3D printers and design prototype models in several engineering fields. The information gathered will assist students with their existing projects related to mechatronics, robotics, automation…etc.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/\" \/>\n<meta property=\"og:site_name\" content=\"Mechatronics Department\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/Tishkuniversity\/?ref=bookmarks\" \/>\n<meta property=\"article:published_time\" content=\"2021-01-05T10:46:59+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2021-05-26T15:49:41+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/i0.wp.com\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg?fit=433%2C292&ssl=1\" \/>\n\t<meta property=\"og:image:width\" content=\"433\" \/>\n\t<meta property=\"og:image:height\" content=\"292\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Web Admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@tishkuni\" \/>\n<meta name=\"twitter:site\" content=\"@tishkuni\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Web Admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/\"},\"author\":{\"name\":\"Web Admin\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/person\/cc183efecad241176849baa7ffae599a\"},\"headline\":\"Scientific Trip to Field\",\"datePublished\":\"2021-01-05T10:46:59+00:00\",\"dateModified\":\"2021-05-26T15:49:41+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/\"},\"wordCount\":61,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#organization\"},\"image\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg\",\"articleSection\":[\"News\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/\",\"url\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/\",\"name\":\"Scientific Trip to Field - Mechatronics Department\",\"isPartOf\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg\",\"datePublished\":\"2021-01-05T10:46:59+00:00\",\"dateModified\":\"2021-05-26T15:49:41+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage\",\"url\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg\",\"contentUrl\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg\",\"width\":433,\"height\":292,\"caption\":\"Tishk International University | mechatronic Department\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Scientific Trip to Field\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#website\",\"url\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/\",\"name\":\"TIU\",\"description\":\"The Future is Here\",\"publisher\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#organization\",\"name\":\"Mechatronics Department\",\"url\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2020\/09\/Tishk-International-University-Logo.png\",\"contentUrl\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2020\/09\/Tishk-International-University-Logo.png\",\"width\":4034,\"height\":3631,\"caption\":\"Mechatronics Department\"},\"image\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/logo\/image\/\"},\"sameAs\":[\"https:\/\/www.facebook.com\/Tishkuniversity\/?ref=bookmarks\",\"https:\/\/x.com\/tishkuni\"]},{\"@type\":\"Person\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/person\/cc183efecad241176849baa7ffae599a\",\"name\":\"Web Admin\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/secure.gravatar.com\/avatar\/3a47b9231d151155cd33bd25d059ecb52841805eb3d30eec2e06be3ffe6ee961?s=96&d=mm&r=g\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/3a47b9231d151155cd33bd25d059ecb52841805eb3d30eec2e06be3ffe6ee961?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/3a47b9231d151155cd33bd25d059ecb52841805eb3d30eec2e06be3ffe6ee961?s=96&d=mm&r=g\",\"caption\":\"Web Admin\"},\"url\":\"https:\/\/engineering.tiu.edu.iq\/mechatronics\/author\/web_admin\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Scientific Trip to Field - Mechatronics Department","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/","og_locale":"en_US","og_type":"article","og_title":"Scientific Trip to Field - Mechatronics Department","og_description":"The Mechatronics Department organized a trip to help students gain a better understanding in advance manufacturing technologies and product development. The scientific trip allowed the participants to analyze the use of 3D printers and design prototype models in several engineering fields. The information gathered will assist students with their existing projects related to mechatronics, robotics, automation…etc.","og_url":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/","og_site_name":"Mechatronics Department","article_publisher":"https:\/\/www.facebook.com\/Tishkuniversity\/?ref=bookmarks","article_published_time":"2021-01-05T10:46:59+00:00","article_modified_time":"2021-05-26T15:49:41+00:00","og_image":[{"width":433,"height":292,"url":"https:\/\/i0.wp.com\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg?fit=433%2C292&ssl=1","type":"image\/jpeg"}],"author":"Web Admin","twitter_card":"summary_large_image","twitter_creator":"@tishkuni","twitter_site":"@tishkuni","twitter_misc":{"Written by":"Web Admin","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#article","isPartOf":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/"},"author":{"name":"Web Admin","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/person\/cc183efecad241176849baa7ffae599a"},"headline":"Scientific Trip to Field","datePublished":"2021-01-05T10:46:59+00:00","dateModified":"2021-05-26T15:49:41+00:00","mainEntityOfPage":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/"},"wordCount":61,"commentCount":0,"publisher":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#organization"},"image":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage"},"thumbnailUrl":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg","articleSection":["News"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/","url":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/","name":"Scientific Trip to Field - Mechatronics Department","isPartOf":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#website"},"primaryImageOfPage":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage"},"image":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage"},"thumbnailUrl":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg","datePublished":"2021-01-05T10:46:59+00:00","dateModified":"2021-05-26T15:49:41+00:00","breadcrumb":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#primaryimage","url":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg","contentUrl":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2021\/01\/trip1_433x292.jpeg","width":433,"height":292,"caption":"Tishk International University | mechatronic Department"},{"@type":"BreadcrumbList","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/scientific-trip-to-field-ready\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/"},{"@type":"ListItem","position":2,"name":"Scientific Trip to Field"}]},{"@type":"WebSite","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#website","url":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/","name":"TIU","description":"The Future is Here","publisher":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#organization","name":"Mechatronics Department","url":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/logo\/image\/","url":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2020\/09\/Tishk-International-University-Logo.png","contentUrl":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-content\/uploads\/2020\/09\/Tishk-International-University-Logo.png","width":4034,"height":3631,"caption":"Mechatronics Department"},"image":{"@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/Tishkuniversity\/?ref=bookmarks","https:\/\/x.com\/tishkuni"]},{"@type":"Person","@id":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/#\/schema\/person\/cc183efecad241176849baa7ffae599a","name":"Web Admin","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/3a47b9231d151155cd33bd25d059ecb52841805eb3d30eec2e06be3ffe6ee961?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/3a47b9231d151155cd33bd25d059ecb52841805eb3d30eec2e06be3ffe6ee961?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/3a47b9231d151155cd33bd25d059ecb52841805eb3d30eec2e06be3ffe6ee961?s=96&d=mm&r=g","caption":"Web Admin"},"url":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/author\/web_admin\/"}]}},"_links":{"self":[{"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/posts\/3960","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/users\/67"}],"replies":[{"embeddable":true,"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/comments?post=3960"}],"version-history":[{"count":1,"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/posts\/3960\/revisions"}],"predecessor-version":[{"id":3994,"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/posts\/3960\/revisions\/3994"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/media\/4204"}],"wp:attachment":[{"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/media?parent=3960"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/categories?post=3960"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/engineering.tiu.edu.iq\/mechatronics\/wp-json\/wp\/v2\/tags?post=3960"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}