{"id":5758,"date":"2021-11-28T14:13:42","date_gmt":"2021-11-28T11:13:42","guid":{"rendered":"http:\/\/engineering.tiu.edu.iq\/computer\/?p=5758"},"modified":"2022-01-18T22:41:42","modified_gmt":"2022-01-18T19:41:42","slug":"scientific-field-trip-to-high-smart-company","status":"publish","type":"post","link":"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/","title":{"rendered":"Scientific Field Trip to High Smart Company"},"content":{"rendered":"<p style=\"text-align: justify;\">On Thursday, 25th of November, 2021, the department of Computer Engineering, in partnership with High Smart company, have organized a scientific trip for the department&#8217;s senior year students to High Smart company\u2019s Erbil office, to expose the students to the processes of designing and implementing a smart house in aims of creating a good starting ground for the students&#8217; potential to launch a career in IoT.<\/p>\n<p style=\"text-align: justify;\">Mr. Karzan T. Gharib, the CEO of the company welcomed the students and gave a brief history on the establishment of the company, the services, products and quality of the products used in implementing the smart house solutions.<\/p>\n<p style=\"text-align: justify;\">Later on, Mr. Ibrahim K. Mohammed, the CTO of the company, gave the students a tour around the company&#8217;s show room to further explain the functionality of the products used in smart home automation and control. The protocols used and the interfacing and configuration between the control software and the devices. Further on, an example of a fully automated room, door lock systems and home cinema were demonstrated to the students along with other technical aspects involved in the process of smart home control.<\/p>\n<p style=\"text-align: justify;\">The visit, which came together as part of the departmental yearly activity plan, was concluded with a question and answers sessions lead by Mr. Ibrahim, whereby the students were given the chance to ask their questions regarding the security of the systems and the programming languages used in the backend along with detailed questions regarding the internet protocols used.<\/p>\n<p style=\"text-align: justify;\">The department of computer engineering would like to extend its gratitude and appreciation to the staff of High Smart Company for their beneficial seminar and for their help in making this event happen.<\/p>\n<p>&nbsp;<\/p>\n\n\t\t<style type=\"text\/css\">\n\t\t\t#gallery-1 {\n\t\t\t\tmargin: auto;\n\t\t\t}\n\t\t\t#gallery-1 .gallery-item {\n\t\t\t\tfloat: left;\n\t\t\t\tmargin-top: 10px;\n\t\t\t\ttext-align: center;\n\t\t\t\twidth: 100%;\n\t\t\t}\n\t\t\t#gallery-1 img {\n\t\t\t\tborder: 2px solid #cfcfcf;\n\t\t\t}\n\t\t\t#gallery-1 .gallery-caption {\n\t\t\t\tmargin-left: 0;\n\t\t\t}\n\t\t\t\/* see gallery_shortcode() in wp-includes\/media.php *\/\n\t\t<\/style>\n\t\t<div id='gallery-1' class='gallery galleryid-5758 gallery-columns-1 gallery-size-full'><dl class='gallery-item'>\n\t\t\t<dt class='gallery-icon landscape'>\n\t\t\t\t<img decoding=\"async\" width=\"2560\" height=\"1920\" data-src=\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-scaled.jpg\" class=\"attachment-full size-full lazyload\" alt=\"Tishk International University | Computer Engineering Department\" data-srcset=\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-200x150.jpg 200w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-300x225.jpg 300w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-400x300.jpg 400w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-600x450.jpg 600w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-768x576.jpg 768w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-800x600.jpg 800w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-1024x768.jpg 1024w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-1200x900.jpg 1200w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-1536x1152.jpg 1536w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/IMG_1276-scaled.jpg 2560w\" data-sizes=\"(max-width: 2560px) 100vw, 2560px\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" style=\"--smush-placeholder-width: 2560px; 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--smush-placeholder-aspect-ratio: 2560\/1920;\" \/>\n\t\t\t<\/dt><\/dl><br style=\"clear: both\" \/>\n\t\t<\/div>\n\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>On Thursday, 25th of November, 2021, the department of Computer Engineering, in partnership with High Smart company, have organized a scientific trip for the department&#8217;s senior year students to High Smart company\u2019s Erbil office, to expose the students to the processes of designing and implementing a smart house in aims of creating a good starting ground for the students&#8217; potential to launch a career in IoT. Mr. Karzan T. Gharib, the CEO of the company welcomed the students and gave a brief history on the establishment of the company, the services, products and quality of the products used in implementing the <a href=\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/\"> [&#8230;]<\/a><\/p>\n","protected":false},"author":57,"featured_media":5768,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wds_primary_category":0,"footnotes":""},"categories":[2],"tags":[],"class_list":["post-5758","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-and-announcements"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.2 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Scientific Field Trip to High Smart Company - Computer Engineering Department<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Scientific Field Trip to High Smart Company - Computer Engineering Department\" \/>\n<meta property=\"og:description\" content=\"On Thursday, 25th of November, 2021, the department of Computer Engineering, in partnership with High Smart company, have organized a scientific trip for the department&#8217;s senior year students to High Smart company\u2019s Erbil office, to expose the students to the processes of designing and implementing a smart house in aims of creating a good starting ground for the students&#8217; potential to launch a career in IoT. Mr. Karzan T. Gharib, the CEO of the company welcomed the students and gave a brief history on the establishment of the company, the services, products and quality of the products used in implementing the [...]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/\" \/>\n<meta property=\"og:site_name\" content=\"Computer Engineering Department\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/Tishkuniversity\/?ref=bookmarks\" \/>\n<meta property=\"article:published_time\" content=\"2021-11-28T11:13:42+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2022-01-18T19:41:42+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/Copy-of-spring-semester-schedule-1024x576.png\" \/>\n\t<meta property=\"og:image:width\" content=\"1024\" \/>\n\t<meta property=\"og:image:height\" content=\"576\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"Web Admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@tishkuni\" \/>\n<meta name=\"twitter:site\" content=\"@tishkuni\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Web Admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/\"},\"author\":{\"name\":\"Web Admin\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/computer\/#\/schema\/person\/6950fcafea2cc5467e5114842fceb89e\"},\"headline\":\"Scientific Field Trip to High Smart Company\",\"datePublished\":\"2021-11-28T11:13:42+00:00\",\"dateModified\":\"2022-01-18T19:41:42+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/\"},\"wordCount\":300,\"publisher\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/computer\/#organization\"},\"image\":{\"@id\":\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2021\/11\/Copy-of-spring-semester-schedule.png\",\"articleSection\":[\"News\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/\",\"url\":\"https:\/\/engineering.tiu.edu.iq\/computer\/scientific-field-trip-to-high-smart-company\/\",\"name\":\"Scientific Field Trip to High Smart Company - 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