{"id":4087,"date":"2020-02-05T11:40:24","date_gmt":"2020-02-05T08:40:24","guid":{"rendered":"http:\/\/engineering.tiu.edu.iq\/computer\/?p=4087"},"modified":"2020-10-18T11:38:37","modified_gmt":"2020-10-18T08:38:37","slug":"field-ready-erbil-makerspace-visit","status":"publish","type":"post","link":"https:\/\/engineering.tiu.edu.iq\/computer\/field-ready-erbil-makerspace-visit\/","title":{"rendered":"Field Ready: Erbil Makerspace visit"},"content":{"rendered":"<p style=\"text-align: justify;\">As part of the on-going developments within the faculty of Engineering of Tishk International University and in pursuit of strengthening ties and collaborations between academia and fast-growing initiatives. The faculty of Engineering have organized a visit to Field Ready: Erbil Makerspace on Tuesday, November 19th, 2019.<\/p>\n<p style=\"text-align: justify;\">A delegation from the department of Computer Engineering represented by Dr. Mohammed Aldabagh and Dr. Yasir Hashim accompanied other delegates from various departments within the faculty along with Dr. Halit Vural, the Dean of Engineering Faculty.<\/p>\n<p style=\"text-align: justify;\">Ms. Ravin Rizgar, Technical team-leader in Erbil Makerspace gave an informative presentation about the organization\u2019s aim in providing the youth with the opportunity to gain practical digital fabrication skills, which, in turn, will boost their future employability, opportunities to engage in entrepreneurship, and prospects for peace.<\/p>\n<p style=\"text-align: justify;\">Erbil Makerspace is a place to learn, create and develop products using physical fabrication equipment, such as 3D printers (plastic and rubber), CNC machines (for etching PCBs) and laser-cutters (to work with wood, acrylic and metal sheets), microprocessors and circuity parts and soldering materials. The makerspace will further promote and enhance the student learning environment and support provided for some of the relevant departmental courses and will also inspire and widen the students\u2019 imagination, skills and creativity spectrum.<\/p>\n<p>&nbsp;<\/p>\n\n\t\t<style type=\"text\/css\">\n\t\t\t#gallery-1 {\n\t\t\t\tmargin: auto;\n\t\t\t}\n\t\t\t#gallery-1 .gallery-item {\n\t\t\t\tfloat: left;\n\t\t\t\tmargin-top: 10px;\n\t\t\t\ttext-align: center;\n\t\t\t\twidth: 50%;\n\t\t\t}\n\t\t\t#gallery-1 img {\n\t\t\t\tborder: 2px solid #cfcfcf;\n\t\t\t}\n\t\t\t#gallery-1 .gallery-caption {\n\t\t\t\tmargin-left: 0;\n\t\t\t}\n\t\t\t\/* see gallery_shortcode() in wp-includes\/media.php *\/\n\t\t<\/style>\n\t\t<div id='gallery-1' class='gallery galleryid-4087 gallery-columns-2 gallery-size-full'><dl class='gallery-item'>\n\t\t\t<dt class='gallery-icon landscape'>\n\t\t\t\t<img decoding=\"async\" width=\"2560\" height=\"1920\" data-src=\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-scaled.jpg\" class=\"attachment-full size-full lazyload\" alt=\"Tishk International University | Computer Engineering Department\" data-srcset=\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-200x150.jpg 200w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-300x225.jpg 300w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-400x300.jpg 400w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-600x450.jpg 600w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-768x576.jpg 768w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-800x600.jpg 800w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-1024x768.jpg 1024w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-1200x900.jpg 1200w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-1536x1152.jpg 1536w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/IMG_20191119_183900-1-scaled.jpg 2560w\" data-sizes=\"(max-width: 2560px) 100vw, 2560px\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" style=\"--smush-placeholder-width: 2560px; --smush-placeholder-aspect-ratio: 2560\/1920;\" \/>\n\t\t\t<\/dt><\/dl><dl class='gallery-item'>\n\t\t\t<dt class='gallery-icon landscape'>\n\t\t\t\t<img decoding=\"async\" width=\"2560\" height=\"1440\" data-src=\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-scaled.jpg\" class=\"attachment-full size-full lazyload\" alt=\"Tishk International University | Computer Engineering Department\" data-srcset=\"https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-200x113.jpg 200w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-300x169.jpg 300w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-400x225.jpg 400w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-600x338.jpg 600w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-768x432.jpg 768w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-800x450.jpg 800w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-1024x576.jpg 1024w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-1200x675.jpg 1200w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-1536x864.jpg 1536w, https:\/\/engineering.tiu.edu.iq\/computer\/wp-content\/uploads\/2020\/02\/20190624_191600-1-scaled.jpg 2560w\" data-sizes=\"(max-width: 2560px) 100vw, 2560px\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" style=\"--smush-placeholder-width: 2560px; --smush-placeholder-aspect-ratio: 2560\/1440;\" \/>\n\t\t\t<\/dt><\/dl><br style=\"clear: both\" \/>\n\t\t<\/div>\n\n","protected":false},"excerpt":{"rendered":"<p>As part of the on-going developments within the faculty of Engineering of Tishk International University and in pursuit of strengthening ties and collaborations between academia and fast-growing initiatives. The faculty of Engineering have organized a visit to Field Ready: Erbil Makerspace on Tuesday, November 19th, 2019. A delegation from the department of Computer Engineering represented by Dr. Mohammed Aldabagh and Dr. Yasir Hashim accompanied other delegates from various departments within the faculty along with Dr. Halit Vural, the Dean of Engineering Faculty. Ms. Ravin Rizgar, Technical team-leader in Erbil Makerspace gave an informative presentation about the organization\u2019s aim in providing the <a href=\"https:\/\/engineering.tiu.edu.iq\/computer\/field-ready-erbil-makerspace-visit\/\"> [&#8230;]<\/a><\/p>\n","protected":false},"author":57,"featured_media":4089,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wds_primary_category":0,"footnotes":""},"categories":[2],"tags":[],"class_list":["post-4087","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-and-announcements"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.2 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>- Computer Engineering Department Tishk International University<\/title>\n<meta name=\"description\" content=\"Erbil Makerspace is a place to learn, create and develop products using physical fabrication equipment, such as 3D 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